Main Control PCB
Main Control PCB – Specifications
|
Parameter |
Specification |
|
Base Material |
FR-4, High-Tg FR-4, High-CTI FR-4 |
|
Layer Count |
2 – 20 layers, or as per file |
|
Board Thickness |
0.5 – 3.5 mm, or as per file |
|
Copper Thickness |
0.5 – 6 oz, or as per file |
|
Min Trace/Space |
2.5/2.5 mil – 4/4 mil (per drawing) |
|
Min Hole Size |
0.2 mm (PTH/NPTH) |
|
Surface Finish |
ENIG, HASL (L/F), OSP, ImmAg, ImmSn, Hard Gold |
|
Solder Mask |
Green, White, Red, Black, Blue, Yellow, Purple |
|
Silkscreen |
Black / White |
|
Dimension Tolerance |
±0.10 mm |
|
Impedance Control |
±10% or per file |
The Brain Board
Every electronic product has one. A main control PCB carries the processor, memory, and core logic. It is the board that makes decisions. If it fails, nothing works. Boyastar builds Main Control PCBs with special attention to power delivery and signal routing.
Processors are power-hungry. A modern MCU or application processor might draw several amps at low voltage-1.2V or 1.8V. If the power distribution network has high inductance, the voltage drops during current spikes. This can cause reset or logic errors. Our Main Control PCBs use multiple power and ground planes. Copper thickness ranges up to 6 oz on power sections. We place decoupling capacitors close to IC pins. These practices ensure stable power delivery even during peak current events.
High-speed routing is critical. Processors communicate with memory and peripherals at high speeds. DDR buses run at hundreds of megahertz. Impedance mismatch causes reflections and timing errors. Our boards control impedance to ±10% and match trace lengths within tight tolerances. We support BGA packages with 0.4 mm pitch and finer. Each Main Control PCB is 100% tested. Boyastar has been in PCB manufacturing since 2008. Our facility covers 19,000 square meters and produces over 50,000 square meters monthly. IATF 16949 and UL certifications are in place.
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