Network Data Center PCB
Network and Data Center PCB – Specifications
|
Parameter |
Specification |
|
Base Material |
FR-4, High-Tg FR-4, High-CTI FR-4 |
|
Layer Count |
2 – 20 layers, or as per file |
|
Board Thickness |
0.5 – 3.5 mm, or as per file |
|
Copper Thickness |
0.5 – 6 oz, or as per file |
|
Min Trace/Space |
2.5/2.5 mil – 4/4 mil (per drawing) |
|
Min Hole Size |
0.2 mm (PTH/NPTH) |
|
Surface Finish |
ENIG, HASL (L/F), OSP, ImmAg, ImmSn, Hard Gold |
|
Solder Mask |
Green, White, Red, Black, Blue, Yellow, Purple |
|
Silkscreen |
Black / White |
|
Dimension Tolerance |
±0.10 mm |
|
Impedance Control |
±10% or per file |
Moving Data at Terabit Speed
Data center networks move petabytes every hour. Every packet passes through switches, routers, and servers. The PCBs in these systems must handle the highest speeds and the most demanding signal integrity requirements. Boyastar builds Network and Data Center PCBs for this mission.
Speed creates unique challenges. At 10G and 25G per lane, signal integrity becomes the primary design concern. Impedance mismatch, crosstalk, and reflections all cause errors. Our Network and Data Center PCBs use controlled dielectric materials and carefully designed stack-ups. We maintain impedance within ±10% for all high-speed traces. We support length matching for differential pairs and bus groups to ensure timing alignment.
Power consumption is another factor. Data centers burn megawatts. Every fraction of a volt drop on power planes wastes energy. Our boards use multiple power and ground planes to minimize power distribution losses. Copper thickness can be specified up to 6 oz for high-current sections. We also design for thermal management-more copper and better thermal vias to keep temperatures down. Each board is fully tested. Boyastar has been manufacturing PCBs since 2008. Monthly capacity exceeds 50,000 square meters. IATF 16949 and UL certifications cover all processes.
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