Module PCB
Module PCB – Specifications
|
Parameter |
Specification |
|
Base Material |
FR-4, High-Tg FR-4, High-CTI FR-4 |
|
Layer Count |
2 – 20 layers, or as per file |
|
Board Thickness |
0.5 – 3.5 mm, or as per file |
|
Copper Thickness |
0.5 – 6 oz, or as per file |
|
Min Trace/Space |
2.5/2.5 mil – 4/4 mil (per drawing) |
|
Min Hole Size |
0.2 mm (PTH/NPTH) |
|
Surface Finish |
ENIG, HASL (L/F), OSP, ImmAg, ImmSn, Hard Gold |
|
Solder Mask |
Green, White, Red, Black, Blue, Yellow, Purple |
|
Silkscreen |
Black / White |
|
Dimension Tolerance |
±0.10 mm |
|
Impedance Control |
±10% or per file |
Compact Intelligence Inside Your Product
Electronic systems are shrinking. A product that once filled a 19-inch rack now fits in your hand. This trend forces PCB designers to pack more function into less space. Boyastar builds Module PCBs that support this miniaturization without sacrificing performance or reliability.
Small size is the goal. A module PCB sits inside a larger system. It may be a communication module, a power module, or a data acquisition module. Space is always tight. Our Module PCBs use fine-line technology with minimum trace and space down to 2.5/2.5 mil. We support micro-vias and blind/buried via structures for high-density routing. We also offer 0.2 mm minimum hole size to fit more vias in smaller areas. These capabilities allow us to route complex circuits on boards that measure only a few centimeters across.
But small does not mean fragile. Modules often face thermal stress because they are enclosed with little airflow. Our boards use high-Tg material that withstands elevated temperatures. Copper thickness options up to 6 oz support power-dense modules. We offer multiple surface finishes including ENIG, immersion silver, and OSP-each chosen based on your assembly process. Every Module PCB is 100% electrically tested. Boyastar has been producing PCBs for 18 years. Our 19,000-square-meter factory and 150+ employees deliver over 50,000 square meters monthly. We hold IATF 16949 and UL certifications.
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