Telecom Infrastructure PCB
Telecom Infrastructure PCB – Specifications
|
Parameter |
Specification |
|
Base Material |
FR-4, High-Tg FR-4, High-CTI FR-4 |
|
Layer Count |
2 – 20 layers, or as per file |
|
Board Thickness |
0.5 – 3.5 mm, or as per file |
|
Copper Thickness |
0.5 – 6 oz, or as per file |
|
Min Trace/Space |
2.5/2.5 mil – 4/4 mil (per drawing) |
|
Min Hole Size |
0.2 mm (PTH/NPTH) |
|
Surface Finish |
ENIG, HASL (L/F), OSP, ImmAg, ImmSn, Hard Gold |
|
Solder Mask |
Green, White, Red, Black, Blue, Yellow, Purple |
|
Silkscreen |
Black / White |
|
Dimension Tolerance |
±0.10 mm |
|
Impedance Control |
±10% or per file |
Always On, Always Reliable
Telecom infrastructure equipment never stops. Base stations, microwave links, and optical transport gear run 365 days a year without scheduled downtime. Boyastar builds Telecom Infrastructure PCBs for this always-on environment.
Reliability is measured in years. Telecom boards often stay in service for ten years or more. During that time, they face temperature variations, humidity, and occasional power surges. Our Telecom PCBs use high-Tg FR-4 for resistance to thermal aging. We spec copper thickness based on power requirements and use generous safety margins. Plated through-holes are designed with sufficient wall thickness to withstand multiple reflow cycles and long-term thermal stress.
Signal quality determines system performance. Telecom gear carries high-frequency signals-RF, microwave, and high-speed digital. Our boards control impedance to ±10% and support differential routing for low-voltage signaling. We offer immersion silver surface finish for RF sections to minimize loss. Each Telecom PCB is 100% tested for impedance and continuity. Boyastar has been manufacturing PCBs since 2008. Our 19,000-square-meter plant produces over 50,000 square meters per month. IATF 16949 and UL certifications are standard.
Hot Tags: telecom infrastructure PCB, China telecom infrastructure PCB manufacturers, suppliers, factory
You Might Also Like
Send Inquiry