Energy Storage PCB
Energy Storage PCB – Specifications
|
Parameter |
Specification |
|
Base Material |
FR-4, High-Tg FR-4, High-CTI FR-4 |
|
Layer Count |
2 – 20 layers, or as per file |
|
Board Thickness |
0.5 – 3.5 mm, or as per file |
|
Copper Thickness |
0.5 – 6 oz, or as per file |
|
Min Trace/Space |
2.5/2.5 mil – 4/4 mil (per drawing) |
|
Min Hole Size |
0.2 mm (PTH/NPTH) |
|
Surface Finish |
ENIG, HASL (L/F), OSP, ImmAg, ImmSn, Hard Gold |
|
Solder Mask |
Green, White, Red, Black, Blue, Yellow, Purple |
|
Silkscreen |
Black / White |
|
Dimension Tolerance |
±0.10 mm |
|
Impedance Control |
±10% or per file |
Built for Charge and Discharge Cycles
Energy storage systems see repeated stress. Charging heats the board. Discharging cools it. This thermal cycling happens thousands of times over the product's life. Boyastar builds Energy Storage PCBs that handle this cycling without cracking or delaminating.
Thermal fatigue is the main concern. Every charge/discharge cycle heats the copper traces and the dielectric material. Copper expands more than FR-4. Over time, this repeated stress can crack plated through-holes and weaken solder joints. Our Energy Storage PCBs use high-Tg FR-4 to reduce thermal expansion mismatch. We specify thicker copper in power paths to spread heat more evenly. We also use ENIG surface finish to improve solder joint reliability-solder joints on energy storage boards see the same thermal stress as traces.
High current means high heat. Energy storage boards often carry 50A or more. Our boards support copper thickness up to 6 oz. Wide power traces reduce resistance and lower temperature rise. Thermal vias under power components help conduct heat to internal planes. Each board is 100% tested for continuity and isolation. Boyastar has been manufacturing PCBs since 2008. Our 19,000-square-meter factory produces over 50,000 square meters per month. IATF 16949 and UL certifications are standard.
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