High Temperature PCB
High Temperature PCB – Specifications
|
Parameter |
Specification |
|
Base Material |
FR-4, High-Tg FR-4, High-CTI FR-4 |
|
Layer Count |
2 – 20 layers, or as per file |
|
Board Thickness |
0.5 – 3.5 mm, or as per file |
|
Copper Thickness |
0.5 – 6 oz, or as per file |
|
Min Trace/Space |
2.5/2.5 mil – 4/4 mil (per drawing) |
|
Min Hole Size |
0.2 mm (PTH/NPTH) |
|
Surface Finish |
ENIG, HASL (L/F), OSP, ImmAg, ImmSn, Hard Gold |
|
Solder Mask |
Green, White, Red, Black, Blue, Yellow, Purple |
|
Silkscreen |
Black / White |
|
Dimension Tolerance |
±0.10 mm |
|
Impedance Control |
±10% or per file |
When the Heat Is On
Some applications simply run hot. Engine compartments, furnace controls, and LED drivers all generate significant heat. Standard FR-4 loses its insulation properties above certain temperatures. Boyastar builds High Temperature PCBs using materials designed for these conditions.
Material selection is everything. Our High Temperature PCBs use high-Tg FR-4 with a glass transition temperature above 150°C. The material maintains its structural integrity at high temperatures. Solder mask is specially formulated for heat resistance. Surface finishes are chosen for thermal stability-ENIG and immersion silver perform better than HASL under high heat.
Testing validates performance. We test sample boards at elevated temperatures to confirm that dielectric strength does not degrade. We examine pad adhesion after thermal cycling. Each production board is processed under the same controlled conditions as the test samples. Every board is 100% electrically tested. Boyastar has been manufacturing PCBs since 2008. IATF 16949 and UL certifications apply.
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