Impedance Control PCB
Impedance Control PCB – Specifications
|
Parameter |
Specification |
|
Base Material |
FR-4, High-Tg FR-4, High-CTI FR-4 |
|
Layer Count |
2 – 20 layers, or as per file |
|
Board Thickness |
0.5 – 3.5 mm, or as per file |
|
Copper Thickness |
0.5 – 6 oz, or as per file |
|
Min Trace/Space |
2.5/2.5 mil – 4/4 mil (per drawing) |
|
Min Hole Size |
0.2 mm (PTH/NPTH) |
|
Surface Finish |
ENIG, HASL (L/F), OSP, ImmAg, ImmSn, Hard Gold |
|
Solder Mask |
Green, White, Red, Black, Blue, Yellow, Purple |
|
Silkscreen |
Black / White |
|
Dimension Tolerance |
±0.10 mm |
|
Impedance Control |
±10% or per file |
Getting the Number Right
Impedance is not just a number. It determines whether a high-speed signal arrives cleanly or arrives distorted. Boyastar builds Impedance Control PCBs for customers who need consistent, tightly controlled impedance across their boards.
Every material and dimension affects impedance. Dielectric thickness, trace width, copper thickness, and dielectric constant all combine to create characteristic impedance. Our engineers calculate impedance based on your stack-up and produce boards that match the target within ±10%. We adjust trace widths on inner layers to compensate for the different dielectric constants of prepreg and core materials.
We measure what we build. Each Impedance Control PCB is tested. We use time-domain reflectometers (TDR) to verify impedance along specific traces. We test both single-ended and differential impedance as needed. Results are documented in production test reports. This data confirms that the board meets specifications and catches any process drift. Boyastar has 18 years of PCB manufacturing experience. IATF 16949 and UL certifications are standard.
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