ENIG PCB
ENIG PCB – Technical Specifications
|
Parameter |
Specification / Capability |
|
Base Material |
FR-4, High-Tg FR-4, High-CTI FR-4, etc. |
|
Layer Count |
2 to 20 layers, or as per file |
|
Board Thickness |
0.5 to 3.5 mm, or as per file |
|
Copper Thickness |
0.5 oz to 6 oz, or as per file |
|
Min. Trace Width/Spacing |
2.5/2.5 mil to 4/4 mil (based on drawing) |
|
Min. Hole Size |
0.2 mm (PTH/NPTH), or as per file |
|
Surface Finish |
ENIG, HASL (leaded/lead-free), OSP, Immersion Silver, Immersion Tin, Hard Gold Plating, or as per customer |
|
Solder Mask Color |
Green, White, Red, Black, Blue, Yellow, Purple, etc., or as per customer |
|
Silkscreen Color |
Black / White (others subject to review) |
|
Dimension Tolerance |
±0.10 mm |
|
Impedance Control |
±10%, or as per file |
Superior Solderability and Flatness
An ENIG PCB uses electroless nickel immersion gold surface finish. It is widely used in automotive electronics, communication equipment, industrial control, and medical electronics where soldering performance is critical. ENIG process deposits a nickel layer and a gold layer on copper surfaces. It provides excellent solderability, flatness, and oxidation resistance. It is especially suitable for surface mount soldering of fine-pitch components. Boyastar manufactures ENIG PCBs with 18 years of manufacturing experience. Our factory covers 19,000 square meters with over 150 employees. Monthly production capacity reaches 50,000 square meters. Every ENIG PCB undergoes full traceability from material receiving to final delivery.
ENIG Surface for Fine-Pitch Assembly
ENIG provides superior surface properties. Our ENIG PCB uses electroless nickel immersion gold process. Nickel is deposited first as a diffusion barrier layer. Gold is deposited on top to provide solderability and oxidation resistance. Gold thickness can be customized to your requirements. ENIG surface flatness is better than HASL. It is especially suitable for fine-pitch components and BGA device surface mount soldering. The gold layer effectively protects copper from oxidation. This ensures solderability after long-term storage. Copper thickness ranges from 0.5 oz to 6 oz or as per your file. This adapts to different functional module current requirements. Layer count ranges from 2 to 20 layers. Board thickness ranges from 0.5 to 3.5 mm or as per your file. All products comply with RoHS and REACH standards and meet UL94 V-0 flame retardant rating.
Quality ENIG Processing
Boyastar has mature production capability in ENIG surface finish. We use dedicated surface finish production lines and AOI automatic optical inspection. Every batch undergoes strict incoming inspection, process control, and 100% electrical testing. Our engineering team completes Gerber evaluations within 24 hours. Sample fees are fully deductible from your mass production order. We hold IATF 16949, ISO 9001, ISO 14001, and ISO 45001 certifications. We also hold UL certification with file number E528398. UL certification covers flammability, electrical insulation, and thermal aging tests. These certifications cover quality, environment, occupational health and safety, and product safety. They meet export requirements for North American, EU, and other major markets. Boyastar is your trusted ENIG PCB supplier.
Hot Tags: enig PCB, China enig PCB manufacturers, suppliers, factory, ENEPIG PCB, ENIG PCB, Hard Gold Plated PCB, Immersion Silver PCB, OSP PCB, surface finish pcb
You Might Also Like
Send Inquiry