ENEPIG PCB
ENEPIG PCB – Technical Specifications
|
Parameter |
Specification / Capability |
|
Base Material |
FR-4, High-Tg FR-4, High-CTI FR-4, etc. |
|
Layer Count |
2 to 20 layers, or as per file |
|
Board Thickness |
0.5 to 3.5 mm, or as per file |
|
Copper Thickness |
0.5 oz to 6 oz, or as per file |
|
Min. Trace Width/Spacing |
2.5/2.5 mil to 4/4 mil (based on drawing) |
|
Min. Hole Size |
0.2 mm (PTH/NPTH), or as per file |
|
Surface Finish |
ENIG, HASL (leaded/lead-free), OSP, Immersion Silver, Immersion Tin, Hard Gold Plating, or as per customer |
|
Solder Mask Color |
Green, White, Red, Black, Blue, Yellow, Purple, etc., or as per customer |
|
Silkscreen Color |
Black / White (others subject to review) |
|
Dimension Tolerance |
±0.10 mm |
|
Impedance Control |
±10%, or as per file |
Ultimate Surface Finish for High-Reliability Applications
An ENEPIG PCB uses electroless nickel electroless palladium immersion gold surface finish. It is widely used in high-reliability automotive electronics, aerospace electronics, medical implant devices, and gold wire bonding COB packaging where surface finish quality is extremely critical. ENEPIG adds a palladium layer between nickel and gold. This provides superior corrosion resistance and gold wire bonding capability. Boyastar manufactures ENEPIG PCBs with 18 years of manufacturing experience and mature ENEPIG process capability. Our factory covers 19,000 square meters with over 150 employees. Monthly production capacity reaches 50,000 square meters.
ENEPIG Three-Layer Structure
ENEPIG delivers premium performance. Our ENEPIG PCB uses a three-layer structure: nickel, palladium, and gold. The palladium layer effectively prevents nickel corrosion during the electroless gold deposition process. It provides superior corrosion resistance and gold wire bonding capability. The palladium layer makes ENEPIG an ideal surface finish for gold wire bonding. This adapts to COB packaging and other advanced packaging processes. ENEPIG surface flatness is excellent. It meets the soldering requirements of the finest-pitch components and ultra-high-density BGA packaging. Copper thickness ranges from 0.5 oz to 6 oz or as per your file. Layer count ranges from 2 to 20 layers. Board thickness ranges from 0.5 to 3.5 mm or as per your file. All products comply with RoHS and REACH standards and meet UL94 V-0 flame retardant rating.
Premium Surface Finish Expertise
Boyastar has leading technical capability in ENEPIG premium surface finish. We use dedicated surface finish production lines and AOI automatic optical inspection. Every batch undergoes strict incoming inspection, process control, and 100% electrical testing. We hold over 25 patents. We respond to quality issues within 24 hours. Sample fees are fully deductible from your mass production order. We hold IATF 16949, ISO 9001, ISO 14001, and ISO 45001 certifications. We also hold UL certification with file number E528398. UL certification covers flammability, electrical insulation, and thermal aging tests. These certifications cover quality, environment, occupational health and safety, and product safety. They meet export requirements for North American, EU, and other major markets. Boyastar is your trusted ENEPIG PCB supplier.
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